Photonica

Shunt resistance

Parallel resistance across a diode that provides a leakage current path bypassing the junction. Sets the dark current floor of photodetectors and the leakage floor of laser diodes.

Shunt resistance RshR_\text{sh} is the parallel resistance across a p-n junction that allows current to flow around the junction rather than through it. In an ideal diode, Rsh=R_\text{sh} = \infty (no leakage path). In a real device, RshR_\text{sh} is finite due to physical leakage paths, surface conduction, or process defects.

Modified diode equation including shunt resistance:

I  =  I0[exp ⁣(q(VIRs)nkT)1]+VIRsRsh,I \;=\; I_0 \left[ \exp\!\left( \frac{q(V - I R_s)}{n kT} \right) - 1 \right] + \frac{V - I R_s}{R_\text{sh}},

where RsR_s is series resistance and the second term is shunt current. At low forward bias (or any reverse bias), shunt current can dominate over diode current.

Origins of finite shunt resistance.

OriginTypical contribution to RshR_\text{sh}
Surface leakage at facet edge1 – 100 MΩ
Bulk defects (dislocations, point defects)10 – 1000 MΩ
Contact-to-contact direct path through substrate10 – 1000 MΩ
Mesa sidewall surface conduction1 – 100 MΩ
Passivation pinholes0.1 – 10 MΩ
Bond pad to ground capacitance + leakage100 MΩ – 10 GΩ

For a high-quality InP DFB laser, total RshR_\text{sh} is typically >1> 1 MΩ. For a research-grade photodetector with optimized passivation, RshR_\text{sh} can exceed 10 GΩ.

Why RshR_\text{sh} matters.

1. Dark current floor in photodetectors. A photodetector at zero or small reverse bias has:

Idark    VbiasRsh.I_\text{dark} \;\approx\; \frac{V_\text{bias}}{R_\text{sh}}.

For Vbias=1V_\text{bias} = -1 V and Rsh=1R_\text{sh} = 1 GΩ: Idark=1I_\text{dark} = 1 nA. For Rsh=10R_\text{sh} = 10 MΩ: Idark=100I_\text{dark} = 100 nA. The shot noise of this dark current sets the receiver noise floor at low optical signal levels.

2. Leakage at sub-threshold in lasers. A laser biased below threshold should be off; if RshR_\text{sh} is finite, current flows around the active region without producing optical output. For very-low-threshold lasers (sub-mA), this can be a significant fraction of total injected current.

3. Solar cell efficiency. Solar cells with low RshR_\text{sh} leak photogenerated current through the shunt path instead of delivering it to the load. The fill factor (a measure of solar cell efficiency) drops sharply when RshR_\text{sh} becomes comparable to the cell's load resistance.

4. Forward-bias leakage. Even at typical operating forward bias, a shunt path can carry significant current. For a laser at V=0.8V = 0.8 V (below threshold) and Rsh=1R_\text{sh} = 1 MΩ: leakage = 800 nA. Compared to typical Ith=520I_\text{th} = 5 - 20 mA, this is negligible. For Rsh=1R_\text{sh} = 1 kΩ: leakage = 800 μA — non-negligible and indicating a bad device.

Extraction. Shunt resistance is extracted from the reverse-bias I-V slope:

Rsh    dVdIreverse bias, low |I|,R_\text{sh} \;\approx\; \left. \frac{dV}{dI} \right|_\text{reverse bias, low |I|},

evaluated at a reverse bias where breakdown has not occurred but the diode is fully off. For a photodetector, this is typically V=0.5V = -0.5 to 2-2 V. The slope of the reverse-bias I-V curve is approximately 1/Rsh1/R_\text{sh}.

Diagnostic value.

  • Sudden drop in RshR_\text{sh}: process defect at fabrication, or in-service damage (ESD event, mechanical damage)
  • Gradual drop in RshR_\text{sh}: progressive defect growth, contact migration, or passivation degradation
  • RshR_\text{sh} thermally activated: indicates a thermally-driven leakage mechanism (e.g., generation-recombination at deep traps)
  • RshR_\text{sh} unaffected by light: bulk or interface defect, not photogenerated
  • RshR_\text{sh} drops in light: photoconductive shunt path; e.g., light absorption in unintended region

Improving RshR_\text{sh}.

  • High-quality passivation: SiNₓ or SiO₂ cap layers reduce surface conduction
  • Mesa etching: separate physically separated devices reduce contact-to-contact leakage
  • Bury current paths: lateral oxidation (in VCSELs) or proton implantation eliminates leakage outside the intended path
  • Avoid mid-gap doping: minimize unintended doping that creates compensated semi-insulating regions susceptible to leakage

References: Pierret, Semiconductor Device Fundamentals, Ch. 6; Sze, Physics of Semiconductor Devices, Ch. 13 for the photodetector dark current treatment.